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Freescale Semiconductor Technical Data Document Number: MC33385 Rev. 6.0, 11/2006 Quad Low-side Driver The MC33385 is a Quad Low-side Driver fully protected switch. This device is a general purpose Low-side Driver but has been especially designed to operate in engine management applications as injector driver or automotive gear box. It is interfaced directly with a microcontroller for parallel control of the load and the individual output diagnostic is done through a SPI. The diagnostic logic recognizes 4 failure types at each output stage: overcurrent, short to GND, open load, and over-temperature. Features * RDSON of 250m per Output at 25C * Supplied from the main 5V VCC * Input CMOS Compatible * Diagnostic through SPI * Nominal Current of 2A per Output * Current Limitation at 3A with Automatic Turn Off * Output Internally Clamped at 50V typ for Inductive Load Drive * Junction to Case Thermal Resistance of 4.4C/W * Individual Output over Temperature Shutdown * Pb-Free Packaging Designated by Suffix Code VW 33385 LOW-SIDE DRIVER DH SUFFIX VW SUFFIX (PB-FREE) 98ASH70702A 20-PIN HSOP ORDERING INFORMATION Device MC33385DH/R2 MC33385VW/R2 Temperature Range (TA) -40C to 125C Package 20 HSOP VPWR Voltage Regulator VCC 33385 OUT1 OUT2 OUT3 OUT4 GND1-4 MCU NCS CLK SDI SDO NRE NON1 NON2 NON3 NON4 Figure 1. MC33385 Simplified Application Diagram There are no disclaimers required on the Final publication of a data sheet. (c) Freescale Semiconductor, Inc., 2007. All rights reserved. BLOCK DIAGRAM BLOCK DIAGRAM VCC TRIGGER Charge Pump NON1 NON2 NON3 NON4 RES URES Over-temp. detection URES RES S DRIVER R OUT1 OUT2 dv/dt control OUT3 OUT4 FR Reset VCC IRES ON1 I-SCB filter t-ISCB ON1 SDI VCC I-OL filter t-IOL CLK VCC Shift Register NCS IRES NON1 Failure Register (FR) SCG filter t-SCG URES RES Vref OSC SDO Under Voltage Reset Reset Oscillator GND NRES Figure 2. 33385 Simplified Internal Block Diagram 33385 2 Analog Integrated Circuit Device Data Freescale Semiconductor PIN CONNECTIONS PIN CONNECTIONS 21 GND2 1 OUT2 2 N.C 3 NON2 4 SDI 5 20 GND1 19 OUT1 18 N.C 17 NON1 16 SDO Heat sink CLK 6 NCS 7 NON4 8 OUT4 9 GND4 10 21 15 NRES 14 VCC 13 NON3 12 OUT3 11 GND3 Figure 3. 33385 Pin Connections Table 1. 33385 Pin Definitions Pin Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 OUT1 GND1 Case NON2 SDI CLK NCS NON4 OUT4 GND4 GND3 OUT3 NON3 Vcc NRES SDO NON1 Pin Name GND2 OUT2 Ground 2 Output Channel 2 NC Input Control Signal for Channel 2 Serial Data Input Clock Line for Serial Interface Chip Select for Serial Interface Input Control Signal for Channel 4 Output Channel 4 Ground 4 Ground 3 Output Channel 3 Input Control Signal for Channel 3 5V Power Supply Reset Input Data Output of Serial Interface Input Control Signal Channel 1 NC Output Channel 1 Ground 1 Connected to the PCB Ground for Thermal Purposes Definition 33385 Analog Integrated Circuit Device Data Freescale Semiconductor 3 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings ELECTRICAL RATINGS Voltage Range Continuous Output Voltage (With no reverse current) Continuous Current Peak Output Current Clamped Energy at the Switching OFF (See Figure 9) Input Voltage (Inputs) Input Protection Diode Current Input Voltage (Outputs) Input Protection Diode Current THERMAL RATINGS Operating Junction Temperature Thermal Resistance : Junction-case (One power stage in use) Thermal Resistance : Junction-ambient (Device soldered on printed circuit board) Peak Package Reflow Temperature During Reflow (1), (2) TJ RTHJC RTHJA TPPRT 150 4.5 50 Note 2 C k k C Vcc VOUT IOUTC IOUTP WOFF VIN IIN VO IO 7.0 45 2.5 ISCBMAX 70 VCC + 0.3 1.0 VCC + 0.3 1.0 V V A A mJ for 1ms V mA V mA Symbol Value Unit Notes 1. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 2. Freescale's Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. 33385 4 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS STATIC CHARACTERISTICS STATIC CHARACTERISTICS Table 3. Static Electrical Characteristics Characteristics noted under conditions 7.0 V VSUP 18 V, - 40C TA 125C, GND = 0 V unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25C under nominal conditions unless otherwise noted. Characteristic SUPPLY VOLTAGE Supply Voltage Range JUNCTION TEMPERATURE Junction Temperature Continuous (Continuous) Junction Temperature Dynamical (Time limited) OUTPUT CURRENT Output Current Range RESET BEHAVIOUR Reset Changeable (at NRES-Pin) Undervoltage Reset (Independent of NRES) Active for VCC = 0V to VCCPRO UNDERVOLTAGE PROTECTION Protection active for VCC =0V to VCCPRO OVER TEMPERATURE Temperature Detection Threshold SUPPLY CURRENT Standby Current (without load) (NON1...NON4 = High Level) 5.15V VCC 5.5V VCC Operating Mode (For 5.15V VCC) (Iout 1...4) = 2A ICC During Reverse Output Current (IOUT = - 5A on one output) INPUTS (NONx, NCS, CLK, NRES, SDI) Low Threshold High Threshold Hysteresis Input Current (VIN = VCC) Input Current (VCC >VRES & 0V Analog Integrated Circuit Device Data Freescale Semiconductor 5 ELECTRICAL CHARACTERISTICS STATIC CHARACTERISTICS Table 3. Static Electrical Characteristics (continued) Characteristics noted under conditions 7.0 V VSUP 18 V, - 40C TA 125C, GND = 0 V unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25C under nominal conditions unless otherwise noted. Characteristic Leakage Current 1 (NON = High, VOUT = 25V, VCC = 5V) Leakage Current 2 (NON = High, VOUT = 16V, VCC = 1V) Output Clamp Voltage (IOUT = 1A) Matching Clamp Voltage (Between two outputs) Clamped Energy at the Switching OFF (See Figure 9) On Resistance (IOUT = 2A, TJ = 150C, NON = LOW) Output Low Voltage Limitation (IOUT = 150mA) Output Capacitance (Guaranteed by design) OUTPUTS REVERSE DIODE Reverse Output Current Reverse Peak current Reverse Voltage Drop - IOUT = - 5A - IOUT = - 2,5A POWERSTAGE PROTECTION Short Current Limit VCC Undervoltage DIAGNOSTIC Short to GND Threshold Voltage for IOUT 2A Open Load Threshold Current Pull-up Resistor Temperature Detection Threshold Notes (1) Symbol IOUTL IOUTL2 VCLP VCLPM WOFF RDSON VOUTLIM COUT Min Typ Max 10 10 Unit A A V V mJ for 1ms 45 VCLP-1 50 50 58 VCLP+1 500 65 220 350 m mV pF IRD IRDP 2,5 5.0 A A VRD1 VRD2 1.0 0.85 1.7 1.7 V V ISCB VCCMIN 3.0 3.35 5 3.95 A V VREF IOL ROL TOFF 0.390xVCC 10 2.0 155 0.435xVCC 50 8.0 185 V mA k C 1. For t 2ms. Max. reverse current is limited to - 10A (for all outputs together) 33385 6 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS DYNAMIC CHARACTERISTIC DYNAMIC CHARACTERISTIC Table 4. Dynamic Electrical Characteristics Characteristics noted under conditions 7.0 V VSUP 18 V, - 40C TA 125C, GND = 0 V unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25C under nominal conditions unless otherwise noted. Characteristic INPUTS Input Frequency (NON1 to NON4) OUTPUTS TIMING Positive Output Voltage Ramp (with inductive load) VOUT = 4V... 16V VOUT = 16V... Vclp Negative Output Voltage Ramp (25%... 75%) OVRP1 OVRP2 OVRN tDCP 2.0 3.5 1.75 3.0 6.0 3.0 5.0 10 4.0 40 V/s V/s V/s s fIN 0.0 1000 Hz Symbol Min Typ Max Unit Internal Switch-on-Time Charge Pump (NON = LOW... VGATE = 0.9 * VBAT) Turn ON Delay (NON = 50%, VOUT = 0.9 * VBAT) Turn OFF Delay (NON = 50%, VOUT = 0.1 * VBAT) (NON = 50%, VOUT = 4V) Undervoltage Protection Max ON time after a output voltage ramp from 0V to 25V at VCC = 0V...VCCPRO Matching Turn ON Delay (NON = 50%, VOUT = 0.9 * VBAT) Rise time Turn OFF (10% - 90% of VCLP) DIAGNOSTIC Short to GND Filter Time Open Load Filter Time SERIAL DIAGNOSTIC LINK : LOAD CAPACITOR AT SDI AND SDO = 100PF Clock Frequency (50% duty cycle) Minimum Time CLK = HIGH Minimum Time CLK = LOW Propagation Delay (CLF Data at SDO valid) NCS = LOW to Data at SDO Valid CLK Low Before NCS Low (Setup time CLK to NCS change High/Low) CLK Change Low/High after NCS = Low SDI Input Set up Time (CLK change High/Low after SDI data valid) SDI Input Hold Time (SDI data hold after CLK change High/Low) CLK Low Before NCS High tDON 1.0 2.5 5.0 s tDOFFA tDOFFB tRPON 1.0 4.7 3.0 7.5 100 s s s tMON - 3.0 3.0 s tROFF 8.5 12 s TSCG tOL 140 140 250 250 s s fCLK tCLH tCLL tPCLD tPCLD tSCLCH tHCLCL tSCLD tHCLD tSCLCL 3.0 100 100 100 100 100 MHz ns ns ns ns ns 100 20 ns ns 20 150 ns ns 33385 Analog Integrated Circuit Device Data Freescale Semiconductor 7 ELECTRICAL CHARACTERISTICS DYNAMIC CHARACTERISTIC Table 4. Dynamic Electrical Characteristics (continued) Characteristics noted under conditions 7.0 V VSUP 18 V, - 40C TA 125C, GND = 0 V unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25C under nominal conditions unless otherwise noted. Characteristic CLK High After NCS High NCSLow/High to Output Data Flout Capacitance at SDI, SDO, CLk, CS NCS Filter time (Pulses tFNCS will be ignored) Symbol tHCLCH tPCHDZ tPCLD tFNCS 10 Min 150 100 10 40 Typ Max Unit ns ns pF ns 33385 8 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS TIMING DIAGRAMS NCS CLK SDO SDI FR-RESET FSL LSB D1 D2 D3 D4 D5 D6 MSB LSB D1 D2 D3 D4 D5 D6 MSB NOTE : FR -RESET means Reset failure storage (internal signal) Figure 4. Timing Diagram to Read the Diagnostic Register MSB LSB D6 D5 D4 D3 D2 D1 D0 FSL D7 FAILURE INDICATOR BIT Only valid during NCS = LOW to the first Low to High CLK change 1 : failure stored 0 : no failure STATUS CHANNEL 4 11 : no failure 01 : open circuit 10: short to battery or overtemperature 00 : short to gnd STATUS CHANNEL 3 STATUS CHANNEL 2 STATUS CHANNEL 1 Figure 5. Diagnostic Failure Register Structure . NCS tSCLCH tHCLCH tCLH tCLL tSCLCH tHCLCH CLK tCSDV tPCLD FSL tCSDV D0 tHCLD D0 D1 D7 tPCHDZ D7 SDO SDI Figure 6. Serial Interface Timing 33385 Analog Integrated Circuit Device Data Freescale Semiconductor 9 ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS Failure detection time for an SCG failure NON off on SCG-failure VDRAIN VDRAIN < VREF at off-state t-SCG (filter-time) Filter time Failure detection Failure store Figure 7. Diagram to Short-Circuit to GND Failure (SCG-Failure) Detection Sporadic failure detection Statical failure detection Failure detection active for an sporadic OL-failure NON off on Iload I-OL Iload > I-OL Iload > IOL for t > tol Diagnostic active retrigger t filter retrigger filter t < t-ol t-ol (filter-time) tol Sporadic failure-detection Failure detection Failure store Figure 8. Diagram to Open Load Failure (OL-Failure) Detection 33385 10 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS ELECTRICAL PERFORMANCE CURVES 350 300 250 Energy (mJ) 200 150 100 50 0 0 0,5 1,5 1 2 2,5 Pulse-Duration (ms) - 40C 25C 125C 3 3,5 4 Figure 9. Max Clamp- Energy Specification ELECTRICAL PERFORMANCE CURVES 380 3 375 2,75 2,50 ICCSTB (mA) VCC=5,5V 370 365 VINL/VCC 2,25 2 1,75 1,50 1,25 1 -50 -25 0 25 50 75 T, TEMPERATURE (C) 100 125 VCC=5,15V VCC=5,5V 360 355 350 345 340 -50 -25 0 25 50 75 T, TEMPERATURE (C) 100 125 VCC=4,5V Figure 10. Standby Current versus Temperature 12,50 12,00 11,50 ICCOPM (mA) Figure 12. Low Threshold Input Voltage versus Temperature 624 623 622 621 VinH/Vcc 620 619 618 VCC=4,5V ou 5,5V 11,00 10,50 10,00 9,50 9,00 8,50 -50 VCC=5,15V All outputs=2A 617 100 125 616 -50 -25 0 25 50 75 T, TEMPERATURE (C) 100 125 -25 0 25 50 75 T, TEMPERATURE (C) Figure 11. Operating Mode Current versus Temperature Figure 13. High Threshold Input Voltage versus Temperature 33385 Analog Integrated Circuit Device Data Freescale Semiconductor 11 ELECTRICAL CHARACTERISTICS ELECTRICAL PERFORMANCE CURVES 55,00 54,50 54,00 VCCMIN (V) 3,78 3,77 3,76 3,75 3,74 3,73 3,72 3,71 -25 0 25 50 75 T, TEMPERATURE (C) 100 125 3,70 -50 -25 0 25 50 75 T, TEMPERATURE (C) 100 125 53,50 VCLP (V) 53,00 52,50 52,00 51,50 51,00 -50 IOUT1=1A Figure 14. Output Clamp Voltage versus Temperature 400 375 350 RDSON (m) 325 300 275 250 225 200 -50 -25 0 25 50 75 T, TEMPERATURE (C) 100 125 ISCB (A) VCC=4,5V IOUT1=3A Figure 17. Vcc Undervoltage versus Temperature 4,60 4,50 4,40 4,30 4,20 4,10 4,00 3,90 3,80 -50 VCC=4,5V VCC=5,5V -25 0 25 50 75 T, TEMPERATURE (C) 100 125 Figure 15. Rdson versus Temperature 24,50 24,25 24,00 23,75 IOL (mA) 23,50 23,25 23,00 22,75 22,50 -50 Figure 18. Short Current Limit versus Temperature -25 0 25 50 75 T, TEMPERATURE (C) 100 125 Figure 16. Open Load versus Temperature Figure 19. Inductive Switching 33385 12 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS ELECTRICAL PERFORMANCE CURVES In1 (1V/div) VOUT1(2V/div) tDOFFA tDOFFB In1 (1V/div) tDON VOUT1(2V/div) Figure 20. Turn on Delay Figure 21. Turn off Delay 33385 Analog Integrated Circuit Device Data Freescale Semiconductor 13 FUNCTIONAL DESCRIPTION INTRODUCTION FUNCTIONAL DESCRIPTION INTRODUCTION The device is a Quad Low-side Driver driven by four CMOS input stages. Each output power transistor is protected against short to VBAT by a zener clamp against overvoltage. A diagnostic logic recognizes four failure types at the output stage : overcurrent, short to GND, open-load and overtemperature. The failures are individually stored in a byte which can be read out via the serial interface (SPI). If the current through the output stage is lower than the IOL-reference, after a filter time an OL failure will be recognized. This measurement is active while the power stage is switched on. The SCG failure will recognize when the drain voltage is lower than the OL reference limit, while the output stage is switched off. All four outputs have an independent overtemperature detection and shutdown. All failures are stored in individual registers. They can be read by the microprocessor via the serial interface. There is no failure detected if the power stage control time is shorter than the filter time. OUTPUT STAGE CONTROL Each of the four output stages is switched ON and OFF by an individual control line (NON-Input). The logic level of the control line is CMOS compatible. The output transistors are switched off when the inputs are not connected. DIAGNOSTIC INTERFACE The communication between the microprocessor and the failure register runs via the SPI link. If there is a failure stored in the failure register, the first bit of the shift register is set to a high level. With the High/Low change on the NCS pin, the first bit of the diagnostic shift register will be transmitted to the SDO output. The SDO output is the serial output from the diagnostic shift register and it is put into a tri-state when the NCS pin is high. The CLK pin clocks the diagnostic shift register. New SDO data will appear on every rising edge of this pin and new SDI data will be latched on every CLK's falling edge into the shift register. With the first positive pulse of the CLK, the failure register will be cleared. There is no bus collision at a small spike at the NCS. The CLK is always LOW while the NCS-signal is changing. POWER TRANSISTORS Each of the four output stages has its own zener clamp. This causes a voltage limitation at the power transistors when inductive loads are switched off. The drain voltage ramp occurring when output is switched on or off, is within defined limits. Output transistors can be connected in parallel to increase current capability. In this case, the associated inputs should be connected together. SHORT-CIRCUIT AND OVERTEMPERATURE PROTECTION If the output current increases above the short current limit for a time longer than tSCB or if the temperature increases above TOFF then the power transistor is immediately switched off. It remains switched off until the control signal on the NON-Input is switched off and on again. RESET There are two different reset functions realized : Under voltage reset : as long as the VCC voltage is lower than VCCRES, the power stages are switched off and the failure-registers are reset. Reset pin : as long as the NRES-pin is low, following circuits are reset : * Power stages * Failure register DIAGNOSTICS The following failures at the output stage are recognized : Short -Circuit to VBAT or overtemp = SCB (Highest priority) Short -Circuit to GND.................... = SCG Open Load...................................... = OL (Lowest priority) The SCB failure is recognized by an overcurrent (current above the short current limit) or an overtemperature. UNDERVOLTAGE PROTECTION At low VCC voltage, the device remains switched off even if there is a voltage ramp at the OUT pin. 33385 14 Analog Integrated Circuit Device Data Freescale Semiconductor PACKAGING PACKAGE DIMENSIONS PACKAGING PACKAGE DIMENSIONS For the most current package revision, visit www.freescale.com and perform a keyword search using the "98A" listed below. DH SUFFIX VW (PB-FREE) SUFFIX 20-PIN HSOP PLASTIC PACKAGE 98ASH70702A ISSUE B 33385 Analog Integrated Circuit Device Data Freescale Semiconductor 15 PACKAGING PACKAGE DIMENSIONS PACKAGE DIMENSIONS (CONTINUED) DH SUFFIX VW (PB-FREE) SUFFIX 20-PIN HSOP PLASTIC PACKAGE 98ASH70702A ISSUE B 33385 16 Analog Integrated Circuit Device Data Freescale Semiconductor REVISION HISTORY REVISION HISTORY REVISION 6.0 DATE 11/2006 DESCRIPTION OF CHANGES * * * Implemented Revision History page Added Pb-Free suffix code VW Converted to Freescale format, and adjusted to the prevailing form and style 33385 Analog Integrated Circuit Device Data Freescale Semiconductor 17 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 +1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com RoHS-compliant and/or Pb-free versions of Freescale products have the functionality and electrical characteristics of their non-RoHS-compliant and/or non-Pb-free counterparts. For further information, see http://www.freescale.com or contact your Freescale sales representative. For information on Freescale's Environmental Products program, go to http:// www.freescale.com/epp. Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. FreescaleTM and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. (c) Freescale Semiconductor, Inc., 2007. All rights reserved. MC33385 Rev. 6.0 11/2006 |
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